Sign In | Join Free | My ledscreensign.com |
|
Brand Name : GIS
Model Number : DPX725T
Place of Origin : Suzhou, China
High sensing dry film : 360 Pcs/ Hour@20"×24"(500x600mm)
Laser power : 25-50W(optional)
Technology raster : Line Width/line Spacing 20/20μm
Effective exposure area : 635mm*810mm(25"×32")
Board thickness : 0.1~3mm
Line width tolerance : ±10%
File format : Gerber274x,odb++
Outer alignment accuracy : ±12um
LDI Equipment is a reliable and accurate solution for automated wire bonding, which provides the highest level of performance for a variety of processes. It is especially suitable for inner and outer wire bonding, offering an outer alignment accuracy of ±12um and a board thickness range from 0.1 to 3mm. It supports the Gerber274x and ODB++ file format and the effective exposure area is 635mm*810mm(25"×32"). The innovative design of the LDI Equipment guarantees perfect wire bonding with precise leadframe technology. The system is ideal for those looking to improve the efficiency and quality of their automated wire bonding process.
We ship LDI Equipment using sturdy corrugated boxes with foam inserts to ensure the equipment is well protected during transit. All shipments are tracked and customers will receive tracking information to follow their shipment. For international shipments, customers should expect their equipment to arrive within 2-4 weeks.
![]() |
Flexible Scale Modes For LDI Equipment Fixed Scale And Auto Scale Images |